Stage apparatus, lithographic apparatus and device manufacturing method using two patterning devices

ABSTRACT

In order to improve the productivity of a lithographic apparatus, a stage apparatus for holding two patterning devices is described. The patterning devices are arranged such that the distance between the patterns in the scanning direction corresponds to the length of the pattern in the scanning direction. By doing so, an improved exposure sequence may be performed by exposing a first die with a first pattern, skipping a second die adjacent to the first die, and exposing a third die adjacent to the second die using a second pattern.

FIELD

The present invention relates to a stage apparatus, a lithographic apparatus, a masking device and a method for manufacturing a device.

BACKGROUND

A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In that instance, a patterning device, which is alternatively referred to as a mask or a reticle, may be used to generate a circuit pattern to be formed on an individual layer of the IC. This pattern can be transferred onto a target portion (e.g., comprising part of one, or several dies) on a substrate (e.g., a silicon wafer). Transfer of the pattern is typically via imaging onto a layer of radiation-sensitive material (resist) provided on the substrate. In general, a single substrate will contain a network of adjacent target portions that are successively patterned. Known lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing an entire pattern onto the target portion at one time, and so-called scanners, in which each target portion is irradiated by scanning the pattern through a radiation beam in a given direction (the “scanning”-direction) while synchronously scanning the substrate parallel or anti-parallel to this direction.

In order to obtain the appropriate image on the substrate, it may be desirable to expose the target portion on the substrate twice or more. Such multiple exposures can be done using a different pattern for each exposure or using a different optical setting in the projection system or the illumination system of the lithographic apparatus or both. In case a different pattern is used for the different exposures, these different patterns can, e.g., be provided by different patterning devices. As an example, it may be desirable for a substrate to have both an exposure using a phase shift mask and an exposure with a trim mask. It may be desirable that both exposures have different exposure conditions. Conventionally, such a ‘double exposure’ is obtained by first exposing the entire substrate with a first patterning device (e.g., a phase shift mask), then exchanging the first patterning device with a second patterning device (e.g., a trim mask) and finally exposing the entire substrate with the second patterning device. This procedure is rather time consuming and generally result in an inferior performance with respect to throughput (i.e., number of substrates that is processed per unit of time). The drawback of changing the patterning devices can be mitigated by using multiple patterning devices on one stage, as described in U.S. Pat. No. 6,800,408. Despite the use of multiple patterning devices on one stage, the exposure method presented may still have a significant impact on the throughput of the apparatus.

SUMMARY

According to an embodiment of the invention, there is provided a stage apparatus for a lithographic apparatus provided with a projection system for projecting a pattern onto a substrate, wherein the stage apparatus is constructed and arranged for performing a scanning operation of a first and second patterning device with respect to the projection system, whereby during the scanning operation a pattern of the first patterning device and a pattern of the second patterning device are projected on the substrate wherein the stage apparatus is constructed and arranged to position the patterning devices during the scanning operation such that a distance between the patterns substantially equals a predetermined function of the reduction factor of the projection system and a non-zero number of exposure field pitches of a field pattern of the substrate, allowing an exposure of a first exposure field with the first patterning device and a second exposure field with the second patterning device, the second exposure field being spaced apart from the first exposure field by the non-zero number of exposure field pitches.

According to a further embodiment of the invention there is provided a lithographic apparatus comprising:

-   -   an illumination system configured to condition a radiation beam;     -   a stage apparatus constructed and arranged for performing a         scanning operation of a first and second patterning device each         provided with a pattern, the patterning devices being capable of         imparting the radiation beam with the patterns to form a         patterned radiation beam;     -   a substrate table constructed to hold a substrate; and     -   a projection system configured to project the patterned         radiation beam onto a target portion of the substrate, whereby         during the scanning operation the pattern of the first         patterning device and the pattern of the second patterning         device are projected on the substrate and wherein the stage         apparatus is constructed and arranged to position the patterning         devices during the scanning operation such that a distance         between the patterns substantially equals a predetermined         function of the reduction factor of the projection system and a         non-zero number of exposure field pitches of a field pattern of         the substrate, allowing an exposure of a first exposure field         with the first patterning device and a second exposure field         with the second patterning device, the second exposure field         being substantially spaced apart from the first exposure field         by the non-zero number of exposure field pitches.

According to another embodiment of the invention, there is provided a masking device for use in a lithographic apparatus according to the present invention, the masking device comprising:

-   -   a first masking part for, in use, obscuring a first part of the         first patterning device before the pattern of the first         patterning device is imparted by the radiation beam,     -   a second masking part for, in use, obscuring a second part of         the first patterning device after the pattern of the first         patterning device is imparted by the radiation beam and for         obscuring a first part of the second patterning device before         the pattern of the second patterning device is imparted by the         radiation beam and     -   a third masking part for, in use, obscuring a second part of the         second patterning device after the pattern of the second         patterning device is imparted by the radiation beam.

According to an other embodiment of the present invention, there is provided a method of exposing a substrate using a lithographic apparatus provided with a projection system, the method comprising:

-   -   arranging two patterning devices each comprising a pattern on a         stage apparatus such that the patterns of both devices are         arranged adjacent to each other in a scanning direction with a         distance between the patterns substantially equal to a         predetermined function of a reduction factor of the projection         system and a non-zero number of exposure field pitches of a         field pattern of the substrate;     -   providing the substrate on a substrate stage;     -   accelerating both the patterning devices and the substrate to a         predetermined speed relative to the projection system;     -   projecting a pattern of the first patterning device onto a first         field of the substrate while substantially maintaining the         speed;     -   displacing both the patterning devices and the substrate stage         substantially at the predetermined speed thereby skipping the         non-zero number of exposure field pitches on the substrate         arranged adjacent to the first field in the scanning direction;     -   projecting a pattern of the second patterning device onto a         further field of the substrate arranged adjacent to the non-zero         number of exposure field pitches on the substrate in the         scanning direction.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:

FIG. 1A depicts a lithographic apparatus according to an embodiment of the invention;

FIG. 1B shows a stage of the lithographic apparatus according to FIG. 1A;

FIGS. 2 a-2 f schematically depict an exposure sequence according to the present invention;

FIG. 3 schematically depicts two dies composed of a plurality of fields;

FIG. 4 a schematically depicts a possible conventional exposure sequence;

FIG. 4 b schematically depicts a possible exposure sequence according to an embodiment of the present invention;

FIG. 4 c schematically depicts a possible further exposure sequence according to an embodiment of the present invention;

FIG. 4 d schematically shows a number of edge fields and an exposure sequence according to an embodiment of the present invention.

FIG. 5 a schematically depicts a possible conventional exposure sequence using a pattern A;

FIG. 5 b schematically depicts a possible exposure sequence according to an embodiment of the present invention using a pattern A and a pattern B;

FIGS. 6 a and 6 b schematically depict a possible exposure sequence to expose parts of a die with different patterns.

FIG. 7 schematically depicts a stage apparatus according to an embodiment of the present invention;

FIG. 8 schematically depicts an alternative stage apparatus according to an embodiment of the present invention;

FIG. 9 a schematically depicts a second alternative stage apparatus according to an embodiment of the present invention;

FIG. 9 b schematically depicts a third alternative stage apparatus according to an embodiment of the present invention;

FIG. 10 schematically depicts an arrangement of four Y-blades;

FIG. 11 schematically depicts an XY-view on the arrangement of FIG. 10.

FIGS. 12 a-12 n schematically depict an operation sequence of a masking device according to an embodiment of the present invention.

FIG. 13 a schematically depicts an XY view on an arrangement of four Y-blades and four X-blades;

FIG. 13 b schematically depicts a cross-sectional ZY-view (A-A′) on the arrangement of FIG. 13 a.

FIG. 13 c schematically depicts a ZY view on an arrangement of five Y-blades and two X-blades;

FIG. 13 d schematically depicts an XY view on the arrangement of FIG. 13 c;

FIG. 13 e schematically depicts a ZY view on an arrangement of three Y-blades and two X-blades;

FIG. 14 schematically depicts an arrangement for redirecting a radiation beam to different parts of an illumination system;

FIGS. 15 and 16 schematically depict a device for redirecting a radiation beam;

FIG. 17 schematically depicts a front view of the arrangement of FIGS. 15 and 16.

FIG. 18 schematically depicts the time domain graphs of radiation pulses origination of two radiation sources, the combined array of pulses and the arrays of pulses sent to one of two illumination units;

FIG. 19 schematically depicts an illumination unit comprising a number of optical elements and a holder for holding two optical elements.

FIGS. 20 a and 20 b schematically depict two positions of the holder of FIG. 19.

FIG. 20 c schematically depicts the position of the holder as a function of time.

DETAILED DESCRIPTION

FIG. 1 a schematically depicts a lithographic apparatus according to one embodiment of the invention. The apparatus comprises:

-   -   an illumination system (illuminator) IL configured to condition         a radiation beam B (e.g., UV radiation or EUV radiation).     -   a support structure (e.g., a mask table) MT constructed to         support a patterning device (e.g., a mask) MA and connected to a         first positioner PM configured to accurately position the         patterning device in accordance with certain parameters;     -   a substrate table (e.g., a wafer table) WT constructed to hold a         substrate (e.g., a resist-coated wafer) W and connected to a         second positioner PW configured to accurately position the         substrate in accordance with certain parameters; and     -   a projection system (e.g., a refractive projection lens system)         PS configured to project a pattern imparted to the radiation         beam B by patterning device MA onto a target portion C (e.g.,         comprising one or more dies) of the substrate W.

The illumination system may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic or other types of optical components, or any combination thereof, for directing, shaping, or controlling radiation.

The support structure supports, i.e., bears the weight of, the patterning device. It holds the patterning device in a manner that depends on the orientation of the patterning device, the design of the lithographic apparatus, and other conditions, such as for example whether or not the patterning device is held in a vacuum environment. The support structure can use mechanical, vacuum, electrostatic or other clamping techniques to hold the patterning device. The support structure may be a frame or a table, for example, which may be fixed or movable as required. The support structure may ensure that the patterning device is at a desired position, for example with respect to the projection system. Any use of the terms “reticle” or “mask” herein may be considered synonymous with the more general term “patterning device.”

The term “patterning device” used herein should be broadly interpreted as referring to any device that can be used to impart a radiation beam with a pattern in its cross-section such as to create a pattern in a target portion of the substrate. It should be noted that the pattern imparted to the radiation beam may not exactly correspond to the desired pattern in the target portion of the substrate, for example if the pattern includes phase-shifting features or so called assist features. Generally, the pattern imparted to the radiation beam will correspond to a particular functional layer in a device being created in the target portion, such as an integrated circuit.

The patterning device may be transmissive or reflective. Examples of patterning devices include masks, programmable mirror arrays, and programmable LCD panels. Masks are well known in lithography, and include mask types such as binary, alternating phase-shift, and attenuated phase-shift, as well as various hybrid mask types. An example of a programmable mirror array employs a matrix arrangement of small mirrors, each of which can be individually tilted so as to reflect an incoming radiation beam in different directions. The tilted mirrors impart a pattern in a radiation beam which is reflected by the mirror matrix.

The term “projection system” used herein should be broadly interpreted as encompassing any type of projection system, including refractive, reflective, catadioptric, magnetic, electromagnetic and electrostatic optical systems, or any combination thereof, as appropriate for the exposure radiation being used, or for other factors such as the use of an immersion liquid or the use of a vacuum. Any use of the term “projection lens” herein may be considered as synonymous with the more general term “projection system.”

As here depicted, the apparatus is of a transmissive type (e.g., employing a transmissive mask). Alternatively, the apparatus may be of a reflective type (e.g., employing a programmable mirror array of a type as referred to above, or employing a reflective mask).

The lithographic apparatus may be of a type having two (dual stage) or more substrate tables (and/or two or more mask tables). In such machines the additional tables may be used in parallel, or preparatory steps may be carried out on one or more tables while one or more other tables are being used for exposure.

The lithographic apparatus may also be of a type wherein at least a portion of the substrate may be covered by a liquid having a relatively high refractive index, e.g., water, so as to fill a space between the projection system and the substrate. An immersion liquid may also be applied to other spaces in the lithographic apparatus, for example, between the mask and the projection system. Immersion techniques are well known in the art for increasing the numerical aperture of projection systems. The term “immersion” as used herein does not mean that a structure, such as a substrate, must be submerged in liquid, but rather only means that liquid is located between the projection system and the substrate during exposure.

Referring to Figure 1A, the illuminator IL receives a radiation beam from a radiation source SO. The source and the lithographic apparatus may be separate entities, for example when the source is an excimer laser. In such cases, the source is not considered to form part of the lithographic apparatus and the radiation beam is passed from the source SO to the illuminator IL with the aid of a beam delivery system BD comprising, for example, suitable directing mirrors and/or a beam expander. In other cases the source may be an integral part of the lithographic apparatus, for example when the source is a mercury lamp. The source SO and the illuminator IL, together with the beam delivery system BD if required, may be referred to as a radiation system.

The illuminator IL may comprise an adjuster AD for adjusting the angular intensity distribution of the radiation beam. Generally, at least the outer and/or inner radial extent (commonly referred to as σ-outer and σ-inner, respectively) of the intensity distribution in a pupil plane of the illuminator can be adjusted. In addition, the illuminator IL may comprise various other components, such as an integrator IN and a condenser CO. The illuminator may be used to condition the radiation beam, to have a desired uniformity and intensity distribution in its cross-section.

The radiation beam B is incident on the patterning device (e.g., mask MA), which is held on the support structure (e.g., mask table MT), and is patterned by the patterning device. Having traversed the mask MA, the radiation beam B passes through the projection system PS, which focuses the beam onto a target portion C of the substrate W. With the aid of the second positioner PW and position sensor IF (e.g., an interferometric device, linear encoder or capacitive sensor), the substrate table WT can be moved accurately, e.g., so as to position different target portions C in the path of the radiation beam B. A possible arrangement of the positioner PW and the substrate table WT are described in FIG. 1B. Similarly, the first positioner PM and another position sensor (which is not explicitly depicted in FIG. 1A) can be used to accurately position the mask MA with respect to the path of the radiation beam B, e.g., after mechanical retrieval from a mask library, or during a scan. In general, movement of the mask table MT may be realized with the aid of a long-stroke module (coarse positioning) and a short-stroke module (fine positioning), which form part of the first positioner PM. Similarly, movement of the substrate table WT may be realized using a long-stroke module and a short-stroke module, which form part of the second positioner PW. Alternatively, the object table MT or WT can be directly driven by a drive arrangement comprising actuators and/or linear motors rather than applying a cascaded arrangement as described in FIG. 1B.

In the case of a stepper (as opposed to a scanner) the mask table MT may be connected to a short-stroke actuator only, or may be fixed. Mask MA and substrate W may be aligned using mask alignment marks M1, M2 and substrate alignment marks P1, P2. Although the substrate alignment marks as illustrated occupy dedicated target portions, they may be located in spaces between target portions (these are known as scribe-lane alignment marks). Similarly, in situations in which more than one die is provided on the mask MA, the mask alignment marks may be located between the dies.

FIG. 1B shows a substrate stage St (also called substrate chuck) as can be applied in a lithographic apparatus according to FIG. 1A. The stage St comprises the non-stationary parts of the second positioner PW, a mirror block MB, and the substrate table WT mounted to the mirror block MB. In this example, the mirror block MB is provided with interferometer-mirrors which are arranged for cooperation with interferometers for measuring the position of the mirror block MB.

The second positioner PW is arranged for positioning the mirror block MB and the substrate table WT. The second positioner PW comprises the short stroke module (which is provided with a short stroke motor ShM) and the long stroke module (which is provided with a long stroke motor LoM).

The long stroke motor LoM comprises a stationary part LMS that can be mounted to a stationary frame or a balance mass (not shown) and a non-stationary part LMM that is displaceable relative to the stationary part. The short stroke motor ShM comprises a first non-stationary part SMS (that may be mounted to the non-stationary part LMM of the long stroke module) and a second non-stationary part SMM (that may be mounted to the mirror block MB).

It should be noted that the mask table MT and the first positioner PM (see FIG. 1A) may have a similar structure as depicted in FIG. 1B.

A so-called dual stage machine may be equipped with two or more stages as described. Each stage can be provided with an object table (such as the substrate table WT). In such an arrangement, a preparatory step such as the measurement of a height map of the substrate disposed on one of the object tables can be performed in parallel with the exposure of the substrate disposed on another object table. In order to expose a substrate that previously has been measured, the stages may change position from the measurement location to the exposure location (and vice versa). As an alternative, the object tables can be moved from one stage to another.

The apparatus as depicted in FIG. 1A could be used in at least one of the following modes:

1. In step mode, the mask table MT and the substrate table WT are kept essentially stationary, while an entire pattern imparted to the radiation beam is projected onto a target portion C at one time (i.e., a single static exposure). The substrate table WT is then shifted in the X and/or Y direction so that a different target portion C can be exposed. In step mode, the maximum size of the exposure field limits the size of the target portion C imaged in a single static exposure.

2. In scan mode, the mask table MT and the substrate table WT are scanned synchronously while a pattern imparted to the radiation beam is projected onto a target portion C (i.e., a single dynamic exposure). The velocity and direction of the substrate table WT relative to the mask table MT may be determined by the (de-)magnification and image reversal characteristics of the projection system PS. In scan mode, the maximum size of the exposure field limits the width (in the non-scanning direction) of the target portion in a single dynamic exposure, whereas the length of the scanning motion determines the height (in the scanning direction) of the target portion.

3. In another mode, the mask table MT is kept essentially stationary holding a programmable patterning device, and the substrate table WT is moved or scanned while a pattern imparted to the radiation beam is projected onto a target portion C. In this mode, generally a pulsed radiation source is employed and the programmable patterning device is updated as required after each movement of the substrate table WT or in between successive radiation pulses during a scan. This mode of operation can be readily applied to maskless lithography that utilizes programmable patterning device, such as a programmable mirror array of a type as referred to above.

Combinations and/or variations on the above described modes of use or entirely different modes of use may also be employed.

FIGS. 2 a-2 f schematically depicts an exposure sequence according to an embodiment of the present invention that can be applied in a lithographic apparatus.

FIG. 2 a schematically depicts two patterning devices comprising a pattern 10, 11 disposed adjacent to each other in the scanning direction (Y-direction). The patterning devices can be arranged adjacent to a projection system 12 of a lithographic apparatus. Both patterns are spaced apart in the Y-direction over a distance d. The distance d may equal a predetermined function of the reduction factor of the projection system 12 of the lithographic apparatus and a non-zero number of exposure field pitches of a field pattern of the wafer (or substrate). The exposure field pitch can be defined as length in the scanning direction of a field to be exposed on the substrate. As an example, the distance d can be substantially equal to the reduction factor of the projection system of the lithographic apparatus multiplied with the exposure field pitch of the field pattern on the wafer. In case both patterns 10, 11 substantially have the same length in the Y-direction, the distance d may correspond to the length of the patterns in the Y-direction. Other parameters such as the gap between two adjacent fields on the substrate may also be applied in the predetermined function that defines the distance d (see e.g., eq. (1)). In the arrangement as shown in FIGS. 2 a-2 f, both patterns 10,11 substantially have the same length in the Y-direction and the distance d substantially corresponds to this length.

FIG. 2 a further shows a projection beam 15, a projection system 12 and a substrate 17 whereon the patterns are to be projected (in general, the substrate is mounted on a substrate stage, not shown in this figure). Each patterning device can be mounted on a separate object table or both patterning devices can be mounted on a common object table. The object table or tables can be mounted on a stage apparatus comprising a positioning device for positioning the object table or object tables. In order to perform this positioning, the positioning device may comprise a plurality of linear motors and/or actuators for positioning the object table or object tables. For clarity reasons, FIGS. 2 a-2 f do not show the object tables or the positioning device.

It should be noted that an arrangement as described (i.e., an arrangement comprising two patterning devices) enables the use of patterning devices having standardized dimensions. The use of an enlarged single patterning device comprising two patterns adjacent to each other (as, e.g., disclosed in U.S. Pat. No. 6,383,940 wherein two patterns are provided on one patterning device having a comparatively small gap between the patterns) may pose problems in that not all lithographic apparatuses are arranged to handle patterning devices that are larger that the industry standard. Furthermore, in case different illumination settings are desired for the exposure of the different patterns, providing a comparatively small gap between the two adjacent patterns may provide insufficient time to change the illumination settings in between the two exposures. Increasing this gap would however increase the problem to handle the enlarged patterning device. Increasing the time to change the illumination settings by decreasing the scanning velocity may reduce the number of substrates that can be processed per unit of time.

Prior to the exposure of the first pattern 11, both the positioning device provided with the patterning devices and the substrate table can be accelerated to a predetermined speed. Once they are synchronized, the projection of the first pattern 11 on the substrate can start (FIGS. 2 b & 2 c) resulting in the exposure of the first field 13 (FIG. 2 d) by the radiation beam 15. The radiation beam 15 has a width w in the Y-direction, also referred to as the slit-width w. When the first field has been exposed, both the positioning device and the substrate table can substantially maintain their speed. When proceeding at that speed, the substrate table can be displaced over a distance substantially equal to the length of a field in the Y-direction (i.e., one exposure field is ‘skipped’) between the exposure of the first pattern and the exposure of the second pattern. Proceeding with substantially the same speed, the second pattern can subsequently be projected onto a second field 14 (FIGS. 2 e & 2 f). As a result of this process, two fields are exposed on the substrate, both fields being spaced apart over a distance substantially equal to the length of the field in the Y-direction, i.e., in the arrangement as shown, one field is left unexposed between fields 13 and 14.

The size of the exposed fields on the substrate may correspond to the size of the die that is manufactured. Alternatively, the exposed field may only be a part of the die; as such, the die may comprise of a number of adjacent fields that may require exposure by different patterns. Once the different fields of such a die are exposed, so-called stitching techniques can be applied to connect the different fields. Connecting the different fields that form a die may e.g. be obtained by a subsequent exposure of these fields. As an example, FIG. 3 schematically depicts two dies 18 arranged adjacent to each other. Each die comprises four different fields (indicated as A, B, C and D) require a different exposure.

In practice, a small gap δ may remain between adjacent dies on a semiconductor substrate (or wafer) in order to easily separate the individual dies (FIG. 3). Therefore, in case the exposure field size corresponds to the die size, the distance d between the first and second pattern provided on the positioning device may be set according to the following equation: d=(Fs+2·δ)·Rf  (1)

wherein:

Fs=the exposure field size (or die size) on the substrate

δ=the gap between adjacent dies on the substrate

Rf=the reduction factor of the projection system (usually 4 or 5)

(Fs+2δ) corresponds to the gap between a first exposure field in a row of fields arranged in the scanning direction and a third exposure field in this row (see e.g., the distance between dies 25 and 26 in FIG. 4 b). When the distance d between the first and second pattern is set according to equation (1), both the patterning devices and the substrate can substantially maintain their speed in between the exposure of the first and second pattern. In general, δ will be small compared to Fs, therefore, d can approximately be set to Fs·Rf .

In case the exposure field size does not correspond to the die size, the gap between adjacent exposure fields can be much smaller than δ, or may be non-existent (as schematically indicated by the adjacent fields A and B in FIG. 3).

Depending on the actual arrangement of the fields that are exposed, a person skilled in the art can calculate the desired distance between the two patterns on the patterning devices such that both the patterning devices and the substrate can substantially maintain their speed in between the exposure of the first and second pattern. As an example (referring to FIG. 3), in order to expose the fields A and B of dies 18 and 19 of FIG. 3, the patterning devices for exposing these fields can be arranged such that the distance between the patterns in the Y-direction equals (a+b+δ)·Rf , wherein a and b correspond to the length of fields A and B in the Y-direction (see FIG. 3).

The required time Te to expose a field in a step and scan process can be approximated by the following formula:

$\begin{matrix} {T_{e} = {\frac{Y}{v} + \frac{2 \cdot v}{a}}} & \left( {2a} \right) \end{matrix}$

wherein:

Y=distance to be traveled at constant speed (equal to field-size Fs+slit-width w)

v=velocity during scanning

a=maximum acceleration of the positioning device holding the substrate

For a given value of Y and a, the velocity can be optimized to minimize the exposure time T_(e). The optimized velocity V_(opt) is found to be

$\begin{matrix} {V_{opt} = \sqrt{\frac{Y \cdot a}{2}}} & \left( {2b} \right) \end{matrix}$

In a conventional lithographic apparatus, a double exposure of a field may require approximately twice this time.

In case the apparatus is arranged to expose fields on a substrate as indicated in FIGS. 2 a-2 f, the time for exposing two fields T_(e2) can be approximated by:

$\begin{matrix} {T_{e\; 2} = {\frac{Y^{\prime}}{v} + \frac{2 \cdot a}{v}}} & \left( {3a} \right) \end{matrix}$

wherein Y′ corresponds to the distance that can be traveled at substantially constant speed during the exposure of the two fields and in between the two exposures. In case Y′ is approximated by three times Y (the field-size Fs+the slit-width w), the optimal velocity of equation (3a) V_(opt2) can be found to be sqrt(3) times higher than the optimal velocity of eq. (2a):

$\begin{matrix} {V_{{opt}\; 2} = {\sqrt{\frac{Y^{\prime} \cdot a}{2}} \approx \sqrt{\frac{3 \cdot Y \cdot a}{2}} \approx {\sqrt{3} \cdot V_{opt}}}} & \left( {3b} \right) \end{matrix}$

It should be noted that during T_(e2), two fields can be exposed. By applying the optimal velocity according to equations 2b or 3b in respective equations 2a and 3a, one can deduce that the time required per exposure is significantly smaller when the sequence described in FIGS. 2 a-2 f is applied instead of a conventional scanning sequence. In addition to the reduced exposure time (per field), it should be noted that the number of moves that are desired in the non-scanning direction (X-direction) are also reduced (see e.g., FIGS. 3 a and 3 b) As a result, the time to process a substrate can be reduced by approximately 30%.

Based on the above, it should be noted that embodiments of the present invention may also result in an improved throughput (the number of substrates processed per unit of time) in a single exposure situation (i.e., a situation wherein each field on the substrate only requires exposure by one pattern) by applying two substantially identical patterns on the stage apparatus.

The following figures schematically illustrate an exposure sequence of a number of fields on a substrate comparing a conventional approach with an approach according to an embodiment of the present invention. In the examples shown in FIGS. 4 a-4 d, 5 a and 5 b, the exposure field size is assumed to correspond to the die size. FIG. 4 a schematically depicts a possible exposure sequence of a number of fields 21 on a substrate 20, the arrows indicating the order in which the fields are exposed. Also indicated in FIG. 4 a are the exposure field size Fs and the gap δ between adjacent fields as used in equation (1). In between the exposure of two consecutive fields, the object tables provided with the patterning devices and the substrate ‘turn around,’ i.e., they are repositioned to expose the next field by a scanning movement in the opposite direction, and in addition to that, the object table provided with the substrate is also repositioned in the non-scanning direction (X-direction). The combined movement in the scanning direction (Y-direction) and the non-scanning direction (X-direction) is indicated by the curved arrows 22.

FIG. 4 b schematically depicts a possible exposure sequence for a number of fields on a substrate 20 using a lithographic apparatus according to an embodiment of the present invention, comprising a stage apparatus provided with two patterning devices comprising substantially identical patterns, the patterns being displaced over a distance equal to the length of the pattern in the scanning direction (or, e.g., the length according to eq. (1)).

FIG. 4 b schematically depicts the order in which the different fields may be exposed using the stage apparatus as described. The exposure process starts with field 25, followed by field 26. Between the exposure of field 25 and the exposure of field 26, both stage apparatus and substrate stage (i.e., the stage provided with the substrate) may remain at substantially the same (scanning) speed. After the exposure of field 26, both stage apparatus and substrate stage decelerate and accelerate in the opposite direction (−Y) in order to expose field 27 and 28. Once the indicated fields are exposed, the fields that are indicated in FIG. 4 c may be exposed, using a similar approach. It will be appreciated by a person skilled in the art that a substantial part of the substrate may be exposed using the described process resulting in an important reduction of the time to process a substrate. As a consequence, the number of substrates processed per unit of time (i.e., the throughput of the apparatus) can be improved. It should further be noted that embodiments of the present invention may also be applied for the exposure of so-called edge fields or edge dies. Edge fields are exposure fields that are partly located outside the substrate area (FIG. 4 d). FIG. 4 d schematically shows a number of edge fields 29 and an exposure sequence (indicated by the arrows) according to an embodiment of the present invention. The exposure of the edge dies can be done in order to facilitate the further processing of the substrate.

The apparatus according to an embodiment of the present invention may also be applied in case a double exposure is desired for each field on the substrate. Assuming the stage apparatus is provided with two patterning devices comprising a pattern A (e.g., a phase shift mask) and a pattern B (e.g., a trim mask or a binary mask) to be applied on the substrate. It is assumed that the patterns are arranged such that the stage apparatus can maintain a substantially constant speed during the exposure of the substrate with the patterns and in between the exposures.

In a first act of the double exposure process, fields 30, 31, 32 and 33 (see FIG. 5 a) may be exposed in a conventional manner using pattern A (the trajectory followed by the substrate stage is indicated by the arrows). In a second act (FIG. 5 b), fields 35, 36, 37 and 38 may be exposed using pattern A and fields 30, 31, 32 and 33 are exposed with pattern B according to the process described in FIGS. 2 a-2 f. As a result of acts one and two, fields 30, 31, 32 and 33 have been exposed to both the pattern A and the pattern B.

It will be clear to a person skilled in the art that a similar procedure may be applied in case the dies on the substrate are composed of different adjacent fields (see e.g., FIG. 3). FIGS. 6 a and 6 b schematically depict the exposure sequence in case the dies on the wafer are composed of four fields as indicated in FIG. 3 and the patterning devices are arranged to expose fields A and B. FIG. 6 a schematically shows a first sequence of exposures of fields A and B. The exposure order is indicated by the arrows. FIG. 6 b schematically depicts a subsequent exposure sequence. The fields exposed in the first sequence are indicated with a striped pattern.

FIG. 7 schematically discloses a stage apparatus according to an embodiment of the present invention. The apparatus comprises an arrangement comprising two object tables 40, 41. On each object table, a patterning device 42, 43 may be arranged, each patterning device comprising a pattern 44,45. The apparatus further comprises two actuator arrangements 46 and 47 for displacing and positioning the object tables over comparatively small distances. In order to enable these displacements, the actuator arrangement may, as an example, comprise of piezo-actuators or electromagnetic actuators. In a preferred embodiment, the actuator arrangement enables positioning of the object table in six degrees of freedom. In the apparatus as shown in FIG. 7, both actuator arrangements 46 and 47 may be mounted on a common first part 48 of a linear motor assembly for displacing the object tables over comparatively large distances in the Y-direction (the scanning direction). The linear motor assembly further comprises a second part 49 constructed and arranged to co-operate with the first part for generating the required thrust in the Y-direction. In general, one part of the linear motor may comprise an array of alternating polarized permanent magnets, arranged in the Y-direction while the other part comprises an array of coils arranged adjacent to each other in the Y-direction.

In the described arrangement, the actuator assemblies are constructed to enable a positioning of both patterns such that the distance d between both patterns may be made substantially equal to a predetermined function of the reduction factor of the projection system and a non-zero number of exposure field pitches of a field pattern of the substrate. As an example, d may be made equal to the length of a pattern in the Y-direction or equal to a value determined using eq. (1). In order to accommodate patterns of different sizes (e.g., varying from 30 mm to 100 mm), the desired displacement of the object tables relative to the first part 48 (by the actuator assemblies) may be in the order of about 40-50 mm.

Alternatively, rather than mounting both actuator assemblies on a common part of a linear motor assembly, each actuator assembly may be arranged on a separate linear motor part. This is illustrated in FIG. 8. FIG. 8 schematically describes a stage arrangement comprising two object tables 40, 41 provided with a patterning device 42, 43, each object table being mounted on an actuator assembly 46, 47. Each actuator assembly is mounted on a first linear motor part 50, 51 constructed and arranged to co-operate with a common second part 52. In this arrangement, the distance between both patterns 44 and 45 provided on the patterning devices may be adjusted using the linear motors.

A benefit of this arrangement is that the required displacements of the actuator assembly may be substantially reduced compared to the arrangement of FIG. 7. As an example, it may be sufficient to provide an actuator assembly suited for displacements <1 mm in the required degrees of freedom. As a consequence, the actuator assembly may be made substantially smaller and lighter. Rather than having common second part for the linear motors, each linear motor may be provided with its own second part co-operating with the first part 50, 51.

As a second alternative, both patterning devices may be arranged on a common object table constructed to hold both patterning devices in such a configuration that the distance d between both patterns is substantially equal to a predetermined function of the reduction factor of the projection system and a non-zero number of exposure field pitches of a field pattern of the substrate. As an example, d may be equal to the length of a pattern in the Y-direction or equal to a value determined using eq. (1). Such an arrangement is schematically depicted in FIG. 9 a.

FIG. 9 a schematically depicts an object table 55 provided with two patterning devices 56, 57, each provided with a pattern 58, 59. The object table 55 is mounted to an actuator assembly 60 for displacing the object table over comparatively small distances. The actuator assembly is mounted to a first part 61 of a linear motor that is constructed and arranged to co-operate with a second part 62 for displacing the object table over comparatively large distances in the Y-direction. As a third alternative, the object table (or object tables) may be directly driven by a drive arrangement comprising actuators and/or linear motors rather than applying a cascaded arrangement as described in FIGS. 7, 8 or 9 a. FIG. 9 b schematically depicts such an arrangement. The arrangement comprises an object table 55 provided with two patterning devices 56, 57, each provided with a pattern 58, 59 and a drive arrangement 70 comprising a first part 71 and a second part 72. The drive arrangement may, as an example, comprise a linear motor and a plurality of actuators for positioning the object table 55. The first part 71 may, as an example, comprise a plurality of coils interacting with a plurality of permanent magnets arranged on the second part 72 in order to displace and position the object table 55. It will be appreciated that the stage apparatus may also comprises a first drive arrangement similar to the drive arrangement 70 for displacing and positioning a first object table provided with a first patterning device and a second drive arrangement similar to the drive arrangement 70 or displacing and positioning a second object table provided with a second patterning device.

The object table of FIGS. 9 a or 9 b or the object tables of FIGS. 7 and 8 may be provided with a holding device for holding the patterning devices. Such a holding device may comprise vacuum pads or clamps, electrostatic clamps or mechanical clamps for holding the patterning devices and maintaining the position of the patterning devices relative to the object table or object tables substantially constant during the exposure process.

In order to determine the position of the patterning devices relative to, e.g., a reference frame or a projection system, a measurement system such as an interferometer system or an encoder system may be applied. In general, an encoder system may comprise a reading head and a grating. The grating may be one dimensional or two dimensional. As an example, the object table or object tables depicted in FIGS. 7 to 9 b may be provided with one or more encoder reading heads constructed and arranged to co-operate with one or more gratings arranged adjacent to the object tables. In case two object tables are applied, each provided with one or more encoder reading heads, the reading heads can be arranged to co-operate with a common linear or two-dimensional grating. As such, the relative position of both object tables can be determined. By using multiple reading heads in combination with multiple gratings, the position of the object table(s) can be determined in more than one degree of freedom (up to 6 degrees of freedom). The use of encoder systems is more extensively explained in U.S. Patent Application Publication No. 2004-0263846, incorporated herein by reference.

Embodiments of the present invention further provides in a masking device suitable to co-operate with a stage apparatus as described.

In a lithographic apparatus, a masking device is often applied to ensure that only a certain part of the pattern is imaged by the projection beam to the substrate. An example of such a masking device is described in U.S. Patent Application Publication No. 2005-0012913, incorporated herein by reference. In order to stop or to mitigate stray light from impinging on the substrate, a masking device may be applied. In a lithographic projection system, this functionality is typically achieved by providing a masking device at an intermediate plane in the illumination system.

Masking devices usually comprise one or more sets of movable blades. Each set of blades may be mechanically coupled to a support and each support may be mounted on a common frame. The sets of blades may be mechanically coupled or uncoupled. A masking device as described may comprise a first set of blades arranged to move together and apart in a scanning direction (the Y-direction), hereinafter referred to as the Y-blades, and a second set of blades is arranged to move together and apart in a direction perpendicular to the scanning direction (the X-direction), hereinafter referred to as the X-blades.

In case the masking device is applied in a lithographic apparatus provided with a stage apparatus provided with two patterns arranged adjacent to each other in the scanning direction, it may be beneficial to apply a masking device as described in the following figures.

In general, the masking device according to embodiments of the present invention comprises a first masking part for obscuring a first part of a first patterning device before a pattern of the first patterning device is imparted by the radiation beam, a second masking part for obscuring a second part of the first patterning device after the pattern of the first patterning device is imparted by the radiation beam and for obscuring a first part of the second patterning device before a pattern of a second patterning device is imparted by the radiation beam and a third masking part for obscuring a second part of the second patterning device after the pattern of the second patterning device is imparted by the radiation beam.

FIG. 10 schematically depicts an arrangement of four so-called Y-blades 80, 81, 82, 83 arranged adjacent to each other in the Y-direction. The blades are displaceable in the Y-direction by, e.g., electromagnetic actuators or linear motors (not shown). FIG. 11 schematically shows an XY-view of the same blades. By displacing blades 80 and 81 relative to each other in the Y-direction, the gap 90 can be adjusted. Similar, by displacing blades 82 and 83 relative to each other in the Y-direction, the gap 91 can be adjusted.

In order to project the pattern onto a substrate, the following sequence may be applied.

FIG. 12 a schematically depicts an initial arrangement of the Y-blades, the projection beam 95 (originating from an illumination system 96), an arrangement of two patterning devices 84, 85 comprising a pattern 98, 100 arranged at a predefined distance apart in the Y-direction. Initially, blade 83 blocks the projection beam, the blades and the arrangement comprising the patterns are virtually not moving. Starting from this initial position, the arrangement comprising the patterns and blade 83 may accelerate (FIG. 12 b) in order both to be at synchronized speed when the pattern can be imparted by the projection beam (FIG. 12 c). At this point, the projection of the edge of blade 83 substantially corresponds to the edge of the first pattern, thereby obscuring a first part 101 of the first patterning device. Blade 83 and the arrangement comprising the patterns may subsequently proceed at their synchronized speed (FIG. 12 d). At some point, blades 81 and 82 may accelerate (FIG. 12 e), in order to obtain a synchronized speed and position with the second edge of the first pattern when this edge is imparted by the projection beam (FIG. 12 f), thereby obscuring a second part 102 of the first patterning device. Although FIGS. 12 e and 12 f show that blade 80 also accelerates together with blades 81 and 82, this is not an absolute requirement. It is desired that the edge of blade 80 is synchronized with the second edge of the second pattern when this edge is imparted by the projection beam (see FIG. 12 l). When blades 81 and 82 are synchronized with the arrangement comprising the patterns, both the blades and the arrangement may proceed at constant velocity (FIGS. 12 g, 12 h). Because the blades 81 and 82 are arranged in such manner that the projection of the edge of blade 81 corresponds to the first edge of the second pattern (thereby obscuring a first part 103 of the second patterning device) when the projection of the edge of blade 82 corresponds to the second edge of the first pattern, blade 81 is already in the appropriate position for the exposure of the second pattern (FIG. 12 i). Once the projection beam no longer imparts the first edge of the second pattern (FIG. 12 j), blades 81, 82 and 83 can be brought to a stop. Note that blade 80 is held at a position not interfering with the projection beam (FIGS. 12 i, 12 j). When the second edge of the second pattern approaches the projection beam, blade 80 is brought up to speed in synchronism with the arrangement comprising the patterns to arrive at the position depicted in FIG. 12 l, thereby obscuring a second part 104 of the second patterning device. Blade 80 and the arrangement comprising the patterns then proceed at substantially constant speed (FIG. 12 m) until the projection beam can be blocked by the blade 80 (FIG. 12 n). Once this position is reached, both blade 80 and the arrangement comprising the patterns may start decelerating resulting in a position that is substantially the mirror-image of the position shown in FIG. 12 a.

During the exposure sequence as described in FIGS. 12 a-12 n, the second set of blades, the X-blades remain at a predefined distance in the X-direction. An example of an arrangement of the X-blades (together with the Y-blades) is shown in FIG. 13 a. FIG. 13 a schematically depicts an XY-view of the four Y-blades 80, 81, 82 and 83 as shown in FIG. 11 together with four X-blades 105, 106, 107, 108. The X- and Y-blades are arranged in such manner that the edges of the blades that define the non-obscured area are substantially arranged in the same Z-plane. FIG. 13 b shows the A-A′ cross-section. In the arrangement as shown, the X-blades 107 and 108 also need to be displaced in the Y-direction in order to allow blade 81 to displace in the Y-direction (see FIG. 13 b).

FIG. 13 c schematically depicts a YZ view of an alternative arrangement comprising 4 Y-blades 110, 111, 112 and 113 that are arranged at the same Z-position. Blades 110, 111, 112 and 113 can be used in a similar manner as the blades 80, 81, 82 and 83 in the sequence described in FIGS. 12 a to 12 n. In order to accommodate for different distances between the patterns arranged on the support, blades 111 and 112 can be made shorter than the corresponding blades 81 and 82 in the arrangement of FIG. 13 b. As a consequence, a gap may occur between the blades 111 and 112 (see FIG. 13 c) in the Y-direction when the blades are set to span the distance between the patterns in the Y-direction. This gap may be covered by an additional Y-blade 114 to avoid impinging of the radiation beam. As an alternative to covering the gap using an additional blade, the radiation beam can be shut during the transition of the gap between the blades. As can be seen from FIG. 13 c, a displacement of the Y-blades in the Y-direction does not impose a displacement of the X-blade 115, i.e., the X-blade 115 can remain at the same Y-position during the entire exposure sequence. FIG. 13 d schematically shows an XY view of the arrangement of FIG. 13c. FIG. 13 d schematically shows the Y-blades 110, 111, 112 and 113, the optional Y-blade 114 and two X-blades 115 and 116.

FIG. 13 e shows yet another alternative arrangement of the masking device comprising 3 Y-blades 117, 118 and 119. In the arrangement as shown, the Y-blade 118 can be used to follow the second edge of the first pattern (comparable to the functionality of blade 82 in FIG. 12 f) during exposure of the first pattern and to follow the first edge of the second pattern (comparable to the functionality of blade 81 in FIG. 12 i) during the exposure of the second pattern. As such, the blade 118 combines the functionality of blades 81 and 82 in the exposure sequence shown in FIGS. 12 a to 12 n. Because, in general, the length of the blade 118 in the Y-direction may not be equal to the distance between both patterns in the Y-direction, a relative displacement of the blade 118 with respect to the patterns may be required when the blade obscures the radiation beam (i.e., the situation depicted in FIG. 12 h).

It should be noted that a conventional masking device may also be applied. In such an arrangement, the Y-blades have to return to their initial position during the time frame between the exposure of the first pattern and the exposure of the second pattern.

In case a double (or multiple) exposure is desired, it may also be required to apply different illumination setting for the exposure of the patterns. In order to provide the different illumination settings during the exposure of the different patterns, the following arrangement may be applied. FIG. 14 schematically describes an arrangement of two radiation sources 120, 122. The radiation beams originating from these sources are combined into one radiation beam 126 that may be applied in an (optional) first illuminator part 128 after which the radiation beam is sent to either illumination unit 130 or illumination unit 132 using a device 134. As such, the optical path of the illumination system comprises a first branch 133 via the illumination unit 130 and a second branch 135, parallel to the first branch, via the illumination unit 132. In these illumination units, different settings may be applied (e.g., dipole illumination in one part 130 and quadrupole illumination in the other part 132 or dipole illumination in both parts but with a different orientation). The outcoming radiation beams of either part 130 or 132 are further projected to the same location by a second device 136 that may be identical to the device 134. The device 136 ensures that the appropriate beam (either the beam originating from illumination unit part 130 or the beam originating from the illumination unit 132) is imparting the appropriate pattern. As such, the radiation beam originating from the (optional) illuminator part 128 is directed to either the first branch 133 or the second branch 135, such that the radiation beam may be configured by the first illumination unit during the exposure of a first exposure field with a pattern of a first patterning device and that the radiation beam is configured by the second illumination unit during the exposure of a second exposure field with a pattern of a second patterning device.

An example of such a device 136 (and device 134) is shown in FIG. 15. FIG. 15 schematically depicts a device 136 comprising two prisms 137, 138 arranged adjacent to each other in the Y-direction. The prisms 137 and 138 may be displaced along the Y-direction using an actuator or a linear motor (not shown). When the device 136 is in a position as shown relative to a radiation beam 140, this beam can be deflected into the Z-direction. In case the prisms are displaced along the Y-direction (as shown in FIG. 16) the radiation beam 142 (which is parallel to beam 140) can be deflected into the Z-direction. Using this device, two beams originating from different illumination units may be projected alternating on to a patterning device. This can be achieved by synchronously displacing the device 134 and the arrangement comprising the patterning devices.

FIG. 17 shows an XZ-view of the device 136 (or 134).

It should be noted that the arrangement as shown in FIG. 14 may also be applied using a single radiation source provided that this source is powerful enough. As can be seen from eq. 3b, the optimized speed of the stage apparatus is substantially higher than in a conventional lithographic apparatus. As a consequence, a more powerful radiation source may be desired to expose the substrate with the appropriate dose. In order to provide such a powerful radiation source, an arrangement as shown in FIG. 14 may be applied.

It should further be noted that the arrangement of FIG. 14 may be provided with two conventional masking devices arranged in the illumination units 130 and 132, rather than applying a masking device as described in FIGS. 10 to 13 e.

FIG. 18 schematically depicts the radiation pulses of both radiation sources 120 (graph a) and 122 (graph b) as a function of time together with the combined radiation beam (graph c). Using the device 134 (see FIG. 14) part of the combined radiation beam may be sent to illuminator part 130 (graph d) or to illuminator part 132 (graph e)

A benefit of the arrangement using the devices 134 and 136 is that these devices are comparatively small and light. Therefore, a comparatively small actuator or linear motor may be sufficient to displace the devices. The devices 134 and 136 may also be driven by a common actuator or motor.

Alternatively, rather than redirecting the radiation beam to either an illumination unit 130 or an illumination unit 132, an arrangement as depicted in FIG. 19 may be applied. FIG. 19 schematically depicts an illumination system 160 comprising a number of optical elements 162 that may be imparted by a radiation beam 164. The illumination system further comprises a holder 166 for holding two (or more) optical elements 168, 170. The optical elements may be arranged adjacent to each other. The arrangement may comprise an actuator or linear motor for displacing the holder 166 with the optical elements in the direction indicated by the arrow 172. By doing so, one can ensure that the radiation beam is imparted by the optical element 168 during the exposure of a first pattern of an arrangement as shown in FIGS. 12 a-12 n, and that the radiation beam is imparted by the second optical element 170 during the exposure of a second pattern of the arrangement as shown in FIGS. 12 a-12 n. Alternatively, the optical elements may be mounted on a rotating disc driven by a rotary motor.

The arrangement of FIG. 19 enables the use of only one illumination system. In case more than one optical element needs to be changed between both exposures, further holders can be applied. Those multiple holders may be driven by the same actuator. It should be noted that, alternatively, the illumination system may be provided with a holder for each optical element rather than having a common holder for both elements. Each of the holders may be driven either independently by, e.g., a linear motor or they may be driven by a common linear motor.

As an example, the arrangement as shown in FIG. 19 may be applied to use different ‘diffractive optical elements’ during the exposure of the first and second patterns. Such elements may be applied to change the intensity distribution of a radiation beam of the illumination system. In order to change between a first intensity distribution for the exposure of the first pattern and a second intensity distribution for the exposure of the second pattern, the holder 166 of the arrangement of FIG. 19 may comprise two diffractive optical elements arranged adjacent to each other. In order to ensure that the appropriate intensity distribution is applied, the holder 166 comprising the diffractive optical elements can be displaced in synchronism with the stage provided with the first and second pattern such that the radiation beam is imparted or reflected by the first diffractive optical element during the exposure of the first pattern and that the radiation beam is imparted or reflected by the second diffractive optical element during the exposure of the second pattern.

It should be noted that in case the optical elements are arranged in a field plane of the illumination system, they are allowed to displace during the exposure process. As an example, a linear motor (or motors) may be arranged to perform a displacement as indicated in the FIGS. 20 a to 20 c. FIG. 20 a schematically depicts an initial position (the initial position is designated by f) of the holder 166 comprising the optical elements. FIG. 20 c schematically depicts the position (the position reference axis P is indicated in FIGS. 20 a and 20 b) of the holder 166 as a function of time. FIG. 20 b schematically depicts the position of the holder 166 in the position ‘−f’.

The arrangement as shown in FIG. 19 may also be applied to position different optical elements (such as diaphragm's) in a pupil plane of the illumination system. In that case, the optical elements should remain stationary during the exposure process and may only be displaced in between two consecutive exposures.

As an alternative to applying different optical elements, a programmable mirror array may also be applied to provide a change in the intensity distribution for the exposure of the first and second pattern.

Although specific reference may be made in this text to the use of lithographic apparatus in the manufacture of ICs, it should be understood that the lithographic apparatus described herein may have other applications, such as the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin-film magnetic heads, etc. The skilled artisan will appreciate that, in the context of such alternative applications, any use of the terms “wafer” or “die” herein may be considered as synonymous with the more general terms “substrate” or “target portion,” respectively. The substrate referred to herein may be processed, before or after exposure, in for example a track (a tool that typically applies a layer of resist to a substrate and develops the exposed resist), a metrology tool and/or an inspection tool. Where applicable, the disclosure herein may be applied to such and other substrate processing tools. Further, the substrate may be processed more than once, for example in order to create a multi-layer IC, so that the term substrate used herein may also refer to a substrate that already contains multiple processed layers.

Although specific reference may have been made above to the use of embodiments of the invention in the context of optical lithography, it will be appreciated that the invention may be used in other applications, and where the context allows, is not limited to optical lithography.

The terms “radiation” and “beam” used herein encompass all types of electromagnetic radiation, including ultraviolet (UV) radiation (e.g., having a wavelength of or about 365, 355, 248, 193, 157 or 126 nm) and extreme ultra-violet (EUV) radiation (e.g., having a wavelength in the range of 5-20 nm), as well as particle beams, such as ion beams or electron beams.

The term “lens,” where the context allows, may refer to any one or combination of various types of optical components, including refractive, reflective, magnetic, electromagnetic and electrostatic optical components.

While specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described.

The descriptions above are intended to be illustrative, not limiting. Thus, it will be apparent to one skilled in the art that modifications may be made to the invention as described without departing from the scope of the claims set out below. 

1. A stage apparatus for a lithographic apparatus that includes a projection system configured to project a pattern onto a substrate, the stage apparatus comprising: a first object table configured to hold a first patterning device; and a second object table configured to hold a second patterning device wherein the stage apparatus is constructed and arranged: a) to perform a scanning operation of the first and the second patterning device with respect to the projection system, such that during the scanning operation a pattern of the first patterning device and a pattern of the second patterning device are projected on the substrate, and b) to position the first and second patterning devices during the scanning operation such that a distance between the pattern of the first patterning device and the pattern of the second patterning device substantially equals a predetermined function of a reduction factor of the projection system and a non-zero number of exposure field pitches of a field pattern of the substrate so as to expose a first exposure field with the first patterning device and a second exposure field with the second patterning device, the second exposure field being substantially spaced apart from the first exposure field by the non-zero number of exposure field pitches.
 2. A stage apparatus according to claim 1, wherein the non-zero number of exposure field pitches is selected such that an illumination setting of the lithographic apparatus is changed between successive exposures of the first exposure field and the second exposure field.
 3. A stage apparatus according to claim 1, wherein the distance between the pattern of the first patterning device and the pattern of the second patterning device substantially equals the reduction factor of the projection system multiplied by the non-zero number of exposure field pitches.
 4. A stage apparatus according to claim 1, further comprising a positioning device configured to position the first and the second object table during the scanning operation.
 5. A stage apparatus according to claim 4, wherein the positioning device comprises a linear motor assembly configured to displace the first and second object tables over comparatively large distances in a scanning direction and an actuator assembly configured to displace the first and second object tables in at least a direction perpendicular to the scanning direction.
 6. A stage apparatus according to claim 5, wherein said actuator assembly is arranged on a first part of said linear motor assembly and wherein said actuator assembly includes a first actuator configured to displace the first object table and a second actuator configured to displace said second object table.
 7. A stage apparatus according to claim 6, wherein said actuator assembly is configured to displace the first and second object tables relative to said first part in a range of about 40-50 mm.
 8. A lithographic apparatus comprising: an illumination system configured to condition a radiation beam; a stage apparatus constructed and arranged to perform a scanning operation of a first and a second patterning device that each include a pattern, each of the first and second patterning devices being configured to impart the radiation beam with the pattern to form a patterned radiation beam; a substrate table constructed to hold a substrate; and a projection system configured to project the patterned radiation beam onto a target portion of the substrate such that during the scanning operation the pattern of the first patterning device and the pattern of the second patterning device are projected on the substrate, wherein the stage apparatus is constructed and arranged to position the patterning devices during the scanning operation such that a distance between the pattern of the first patterning device and the pattern of the second patterning device substantially equals a predetermined function of a reduction factor of the projection system and a non-zero number of exposure field pitches of a field pattern of the substrate so as to expose a first exposure field with the first patterning device and a second exposure field with the second patterning device, the second exposure field being substantially spaced apart from the first exposure field by the non-zero number of exposure field pitches.
 9. The lithographic apparatus according to claim 8, further comprising a masking device, the masking device comprising: a first masking part configured to obscure a first part of the first patterning device before the pattern of the first patterning device is imparted by the radiation beam, a second masking part configured to obscure a second part of the first patterning device after the pattern of the first patterning device is imparted by the radiation beam and to obscure a first part of the second patterning device before the pattern of the second patterning device is imparted by the radiation beam, and a third masking part configured to obscure a second part of the second patterning device after the pattern of the second patterning device is imparted by the radiation beam.
 10. A lithographic apparatus according to claim 8, wherein the illumination system comprises: an optical path comprising a first branch and a second branch, said first branch coupled in parallel to the second branch, the first branch comprising a first illumination unit configured to condition the radiation beam, and the second branch comprising a second illumination unit configured to condition the radiation beam, and a device configured to direct the radiation beam to the first branch or the second branch, such that the radiation beam is configured by the first illumination unit during exposure of the first exposure field with the pattern of the first patterning device and that the radiation beam is configured by the second illumination unit during exposure of the second exposure field with the pattern of the second patterning device.
 11. A lithographic apparatus according to claim 8, wherein the non-zero number of exposure field pitches is selected such that an illumination setting of the lithographic apparatus is changed between successive exposures of the first exposure field and the second exposure field.
 12. A lithographic apparatus according to claim 8, wherein the distance between the pattern of the first patterning device and the pattern of the second patterning device substantially equals the reduction factor of the projection system multiplied by the non-zero number of exposure field pitches.
 13. A lithographic apparatus according to claim 8, further comprising a positioning device configured to position the first and the second object table during the scanning operation.
 14. A method of exposing a substrate using a lithographic apparatus including a projection system, the method comprising: arranging on a stage apparatus a first and a second patterning device that each comprise a pattern such that the pattern of the first patterning device and the pattern of the second patterning device are adjacent to each other in a scanning direction with a distance between the pattern of the first patterning device and the pattern of the second patterning device substantially equal to a predetermined function of a reduction factor of the projection system and a non-zero number of exposure field pitches of a field pattern of the substrate; accelerating the first and second patterning devices and the substrate to a predetermined speed relative to the projection system; projecting the pattern of the first patterning device onto a first field of the substrate while substantially maintaining said speed; displacing the first and second patterning devices and the substrate substantially at the predetermined speed so as to skip a non-zero number of exposure field pitches on the substrate arranged adjacent to the first field in the scanning direction; and projecting the pattern of the second patterning device onto a second field of the substrate arranged adjacent to the non-zero number of exposure field pitches on the substrate in the scanning direction.
 15. The method according to claim 14, wherein the pattern of the first patterning device and the pattern of the second patterning device are substantially identical.
 16. The method according to claim 14, wherein the pattern of the first patterning device comprises a phase shift mask and wherein the pattern of the second patterning device comprises a trim mask or a binary mask.
 17. The method according to claim 14, further comprising: obscuring a first part of the first patterning device before the pattern of the first patterning device is imparted by a radiation beam; obscuring a second part of the first patterning device after the pattern of the first patterning device is imparted by the radiation beam; obscuring a first part of the second patterning device before the pattern of the second patterning device is imparted by the radiation beam, and obscuring a second part of the second patterning device after the pattern of the second patterning device is imparted by the radiation beam.
 18. The method according to claim 14, wherein the non-zero number of exposure field pitches is selected such that an illumination setting of the lithographic apparatus is changed between successive exposures of the first field and the second field.
 19. The method according to claim 14, wherein the distance between the pattern of the first patterning device and the pattern of the second patterning device substantially equals the reduction factor of the projection system multiplied by the non-zero number of exposure field pitches. 